| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device by which a substrate such as a semiconductor wafer can be detached quickly, certainly and safely from a substrate holder such as top rings without exerting excessive pressure on the substrate, and further can be transferred to a substrate transfer station without giving impact to the substrate, after completion of polishing the substrate. <P>SOLUTION: This polishing device comprises: a substrate holder 1 for holding a semiconductor wafer W; and a substrate transfer station 130 having a substrate mounting part 133 for mounting a semiconductor wafer W thereon and an up-and-down unit 132 for lifting and lowering the substrate mounting part 133. The substrate transfer station 130 has a peeler mechanism in which a tapered member 232a is inserted into a gap formed between the periphery of a substrate W held with the substrate holder 133 and the substrate holder 133, and then while abutting the tapered member 232a on the periphery of the substrate W, it is moved in a direction away from the substrate holder 1, as the result, the substrate W is peeled from the substrate holder 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
