END POINT DETECTION IN GRINDING

摘要

PURPOSE: A method for detecting an end point in a grinding process are provided to accurately detect the end point by using the reflectivity of light from the surface of a wafer. CONSTITUTION: Light emitting and receiving meters(60) are not contacted with a wafer(20) in a grinding process and measure reflectivity. The light emitting and receiving meters include a light emitting meter(60A) and a light receiving meter(60B). The light emitting meter measures emitted light(62). The light receiving meter receives reflected light(64).