发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE: A curable resin composition is provided to form a coating film with excellent heat resistance, adhesion to a substrate, and chemical resistance. CONSTITUTION: A curable resin composition comprises a copolymer which comprises a structure unit derived from an unsaturated carboxylic acid, C2-4 cyclic ether structure, and a structure unit derived from a monomer with an ethylenically unsaturated bond; and a resin which comprises a structure unit derived from an unsaturated carboxylic acid and/or unsaturated carboxylic anhydride and a structure unit derived from a copolymerizable monomer copolymerizable with one or more selected from unsaturated carboxylic acid and unsaturated carboxylic anhydride. The acid value of the resin is 30-240 mg-KOH/g. The content of the copolymer is 40-90 weight% based on the total weight of the copolymer.
申请公布号 KR20130050242(A) 申请公布日期 2013.05.15
申请号 KR20120123425 申请日期 2012.11.02
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 SHIRAKAWA MASAKAZU
分类号 C08L33/00;C08J5/18;C08L35/00;C09D133/00 主分类号 C08L33/00
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