| 发明名称 |
Remelting method and subsequent filling and resulting component |
| 摘要 |
Remelting and filling a defect (7) of a surface (19) of a substrate (4), comprises remelting the defect to form a depression (28), and filling the formed depression. An independent claim is also included for a component comprising a remelted region and a solder region above the remelted region. |
| 申请公布号 |
EP2591872(A1) |
申请公布日期 |
2013.05.15 |
| 申请号 |
EP20110188750 |
申请日期 |
2011.11.11 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
OTT, MICHAEL;PIEGERT, SEBASTIAN;REINKENSMEIER, INGO |
| 分类号 |
B23K1/005;B23K26/34;F01D5/00 |
主分类号 |
B23K1/005 |
| 代理机构 |
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代理人 |
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