| 摘要 |
An image pickup apparatus 1 includes: an image pickup device 13 disposed in a first principal surface 11A of a silicon substrate 11, the image pickup device 13 sensing infrared light; an electrode pad 14 disposed on the first principal surface 11A; a front-face wiring 12 connecting the image pickup device 13 and the electrode pad 14; an external connection terminal 20 disposed on a second principal surface 11B of the silicon substrate 11; a back-face wiring 19 connecting the electrode pad 14 and the external connection terminal 20 via a substrate through-hole 18 extending from the second principal surface 11 B side through the silicon substrate 11 to a back face of the electrode pad 14; and a light blocking layer 22 disposed on the second principal surface 11 B, the light blocking layer 22 covering a trench portion 21 surrounding the image pickup device 13 and a region surrounded by the trench portion 21. |
