METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME

摘要

THE PRESENT INVENTION PROVIDES A METHOD OF FORMING A METAL PATTERN AND A METAL PATTERN OBTAINED BY THE METHOD. THE METHOD INCLUDES THE STEPS OF (I) FORMING ON A SUBSTRATE A POLYMER LAYER IN WHICH A POLYMER HAVING A FUNCTIONAL GROUP THAT INTERACTS WITH AN ELECTROLESS PLATING CATALYST OR A PRECURSOR THEREOF IS CHEMICALLY BONDED DIRECTLY TO THE SUBSTRATE IN A PATTERN FORM, (II) ADDING THE ELECTROLESS PLATING CATALYST OR PRECURSOR THEREOF TO THE POLYMER LAYER, AND (III) FORMING A METAL LAYER IN THE PATTERN FORM BY ELECTROLESS PLATING. THE PRESENT INVENTION ALSO PROVIDES A METHOD OF FORMING A CONDUCTIVE FILM, INCLUDING THE STEPS OF (A) FORMING ON A SUBSTRATE A POLYMERIZATION INITIATING LAYER IN WHICH A POLYMER HAVING, ON A SIDE CHAIN THEREOF, A CROSSLINKING GROUP AND A FUNCTIONAL GROUP HAVING POLYMERIZATION INITIATING CAPABILITY IS IMMOBILIZED BY A CROSSLINKING REACTION ON THE SURFACE OF THE BASE MATERIAL, (B) GENERATING A GRAFT POLYMER BY CHEMICALLY BONDING A POLYMER HAVING A FUNCTIONAL GROUP THAT INTERACTS WITH AN ELECTROLESS PLATING CATALYST OR A PRECURSOR THEREOF DIRECTLY ONTO THE ENTIRE SURFACE OF THE POLYMERIZATION INITIATING LAYER, (C) ADDING THE ELECTROLESS PLATING CATALYST OR PRECURSOR THEREOF TO THE GRAFT POLYMER, AND (D) FORMING A METAL LAYER BY ELECTROLESS PLATING.