METHOD FOR PRODUCING AN INTEGRATED MICROFLUIDIC SYSTEM

摘要

The invention relates to the production of an integrated microfluidic system and to the integrated microfluidic system as such. An electronics substrate, especially a semiconductor chip, is connected to a microfluidic substrate in a flip-chip configuration. For this purpose, the fluidic connecting elements of the two substrates to be interconnected are interconnected by a first adhesive and the electrical contacts of the two substrates are interconnected by a second adhesive. The adhesives are cured, the second adhesive curing first.