STACKED PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stacked package and a manufacturing method thereof are provided to reduce the thermal deformation of a semiconductor package by using a silicon encapsulant. CONSTITUTION: A first package substrate(112) includes a first semiconductor chip(114). A second package substrate(160) includes a second semiconductor chip(164). A conductive member electrically connects the first and second package substrates. A partition structure is formed on the upper side of the outside of the second package substrate. A molding member covers the second semiconductor chip.