| 摘要 |
<p>PROVIDED ARE RESIN COMPOSITION WHOSE STORABILITY IS NOT REDUCED, A PREPREG WHICH USES THE RESIN COMPOSITION AND WHICH IS UNIFORMLY COLORED, A LAMINATED BOARD, A MULTILAYER PRINTED WIRING BOARD HAVING EXCELLENT RESULTS IN RELIABILITY TESTS SUCH AS A THERMAL SHOCK TEST AND THE LIKE, AND A SEMICONDUCTOR DEVICE. THE RESIN COMPOSITION IS A RESIN COMPOSITION FOR A MULTILAYER PRINTED WIRING BOARD, COMPRISING (A) A NOVOLAC TYPE EPOXY RESIN, (B) A CURING AGENT, (C) AN INORGANIC FILLER, AND (D) A COLORANT, WHEREIN THE EXOTHERMIC PEAK TEMPERATURE OF THE RESIN COMPOSITION, AS MEASURED BY DSC, IS WITHIN ±5ºC OF THE EXOTHERMIC PEAK TEMPERATURE OF A RESIN COMPOSITION COMPOSED OF (A) A NOVOLAC TYPE EPOXY RESIN, (B) A CURING AGENT, AND (C) AN INORGANIC FILLER.</p> |
