发明名称 |
Cantilever couplers for intra-chip coupling to photonic integrated circuits |
摘要 |
Development of Integrated Optical Circuits depends greatly on progress in coupling light to and between chip devices. Exemplary disclosed embodiments provide a system and method of fabricating couplers for optical chips that may allow for access to devices on the entire chip surface. Cantilever couplers comprising optical waveguides are deflected out-of-plane creating access to remote portions of devices. An exemplary system and method may provide waveguides with tunable angles of deflection creating greater flexibility in optical coupling options.
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申请公布号 |
US8442368(B1) |
申请公布日期 |
2013.05.14 |
申请号 |
US20100692346 |
申请日期 |
2010.01.22 |
申请人 |
REANO RONALD M.;SUN PENG;THE OHIO STATE UNIVERSITY RESEARCH FOUNDATION |
发明人 |
REANO RONALD M.;SUN PENG |
分类号 |
G02B6/26 |
主分类号 |
G02B6/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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