BUBBLE-FREE ADHESIVE TAPE FOR MANUFACTURING ELECTRONIC COMPONENTS

摘要

PURPOSE: An adhesive tape is provided to prevent the insertion of bubbles in between an adhesive layer and a lead frame regardless of the kind and the design of the lead frame when laminating the lead frame. CONSTITUTION: An adhesive tape for producing bubble-free electronic parts comprises the following: a substrate(2); an adhesive layer(3) formed on one side of the substrate; and a non-adhesive cushion layer(1) formed on the other side of the substrate. The cushion layer is formed with a cushion composition containing a phenoxy resin, a thermosetting agent, an energy beam cure type acrylic resin, and a photoinitiator. The weight average molecular weight of the phenoxy resin is 1,000-500,000. The cushion composition is cured by thermosetting or an energy beam.