| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor power module is provided to reduce standby time by simultaneously printing a substrate and a heat sink with solder. CONSTITUTION: Components have different thicknesses. Cream solder(80) is printed on the upper side of the component. A shape and a structure of a jig(70) have different depths. One or more semiconductor chips are soldered on DBC(Direct Bonded Copper). A substrate is soldered on a heat sink.</p> |
