发明名称 |
Cu pillar bump with non-metal sidewall protection structure |
摘要 |
A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.
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申请公布号 |
US8441124(B2) |
申请公布日期 |
2013.05.14 |
申请号 |
US20100769768 |
申请日期 |
2010.04.29 |
申请人 |
WU YI-WEN;LIN CHENG-CHUNG;HWANG CHIEN LING;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WU YI-WEN;LIN CHENG-CHUNG;HWANG CHIEN LING;LIU CHUNG-SHI |
分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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