发明名称 |
ELECTROCONDUCTIVE MATERIAL, METHOD OF CONNECTION WITH SAME, AND CONNECTED STRUCTURE |
摘要 |
There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent strength in high temperature when used as a solder paste for example, and a bonding method and a bonded structure with high bonding reliability using the same. The conductive material should include a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound showing a melting point of 310°C or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal. In addition, the ratio of the second metal to the metal component is 30% by volume or greater. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal. |
申请公布号 |
KR20130049816(A) |
申请公布日期 |
2013.05.14 |
申请号 |
KR20137007375 |
申请日期 |
2011.03.01 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NAKANO KOSUKE;TAKAOKA HIDEKIYO |
分类号 |
B23K35/22;B23K35/26;B23K35/30;C22C9/05 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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