Plain bearing

摘要

The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 mum is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.