PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR RESIST PATTERN FORMATION, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

This invention provides a photosensitive resin composition comprising (A) a binder polymer comprising a divalent group represented by general formula (I), a divalent group represented by general formula (II), and a divalvent group represented by general formula(III), (B) a photopolymerizable compound, and (C) a photopolymerization initiator comprising a hexaarylbiimidazole compound containing at least one alkoxy group having 1 to 5 carbon atoms. (I) (II) (III) wherein R¹, R³, and R⁵ each independently represent a hydrogen atom or a methyl group; R² and R⁴ each independently represent an alkyl group having 1 to 3 carbon atoms, an alkoxy group, an OH group, or a halogen atom; and m and n are each independently an integer of 0 to 5.