发明名称 |
Patterning process, resist composition, and acetal compound |
摘要 |
A pattern is formed by applying a resist composition comprising a polymer comprising recurring units having an acid labile group-substituted hydroxyl group, an acid generator, and an organic solvent onto a substrate, prebaking the composition to form a resist film, exposing the resist film to high-energy radiation to define exposed and unexposed regions, baking, and developing the exposed film with an organic solvent developer to form a negative pattern wherein the unexposed region of film is dissolved and the exposed region of film is not dissolved. |
申请公布号 |
US8440386(B2) |
申请公布日期 |
2013.05.14 |
申请号 |
US201113053714 |
申请日期 |
2011.03.22 |
申请人 |
HATAKEYAMA JUN;NAGATA TAKESHI;HASEGAWA KOJI;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
HATAKEYAMA JUN;NAGATA TAKESHI;HASEGAWA KOJI |
分类号 |
G03F7/00;G03F7/004;G03F7/20;G03F7/32;G03F7/40 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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