发明名称 Patterning process, resist composition, and acetal compound
摘要 A pattern is formed by applying a resist composition comprising a polymer comprising recurring units having an acid labile group-substituted hydroxyl group, an acid generator, and an organic solvent onto a substrate, prebaking the composition to form a resist film, exposing the resist film to high-energy radiation to define exposed and unexposed regions, baking, and developing the exposed film with an organic solvent developer to form a negative pattern wherein the unexposed region of film is dissolved and the exposed region of film is not dissolved.
申请公布号 US8440386(B2) 申请公布日期 2013.05.14
申请号 US201113053714 申请日期 2011.03.22
申请人 HATAKEYAMA JUN;NAGATA TAKESHI;HASEGAWA KOJI;SHIN-ETSU CHEMICAL CO., LTD. 发明人 HATAKEYAMA JUN;NAGATA TAKESHI;HASEGAWA KOJI
分类号 G03F7/00;G03F7/004;G03F7/20;G03F7/32;G03F7/40 主分类号 G03F7/00
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