发明名称 |
Device and method for making a semiconductor device including bonding two bonding partners |
摘要 |
A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding partner.
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申请公布号 |
US8439249(B2) |
申请公布日期 |
2013.05.14 |
申请号 |
US20090567434 |
申请日期 |
2009.09.25 |
申请人 |
SPECKELS ROLAND;LICHT THOMAS;GUTH KARSTEN;INFINEON TECHNOLOGIES AG |
发明人 |
SPECKELS ROLAND;LICHT THOMAS;GUTH KARSTEN |
分类号 |
B23K20/08;H01L21/00 |
主分类号 |
B23K20/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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