发明名称 Exposure method and electronic device manufacturing method
摘要 An exposure method for exposing a bright-dark pattern onto each exposure region of a substrate via a projection optical system includes a position detection process for detecting positions of a plurality of microscopic regions in a unit exposure field of the substrate, a deformation calculation step of calculating a state of deformation in the unit exposure field based on information related to the positions of the plurality of microscopic regions obtained in the position detection step, and a shape modification step of modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation step. The microscopic regions detected in the position detection step include a circuit pattern formed in the unit exposure field.
申请公布号 US8440375(B2) 申请公布日期 2013.05.14
申请号 US20080071913 申请日期 2008.02.27
申请人 KIUCHI TOHRU;SHIRAISHI NAOMASA;INOUE HIDEYA;NIKON CORPORATION 发明人 KIUCHI TOHRU;SHIRAISHI NAOMASA;INOUE HIDEYA
分类号 G03F9/00 主分类号 G03F9/00
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