发明名称 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
摘要 |
A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.
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申请公布号 |
US8441118(B2) |
申请公布日期 |
2013.05.14 |
申请号 |
US20090589409 |
申请日期 |
2009.10.22 |
申请人 |
HUA FAY;INTEL CORPORATION |
发明人 |
HUA FAY |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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