| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which improves the yield of electronic circuit module manufacturing processes. <P>SOLUTION: A multilayer substrate 1 of this invention comprises: a substrate part 2 where multiple insulation layers are laminated; vias 3 penetrating in the thickness direction of the substrate part 2; first conductive parts 6, each of which is disposed on a center part of the via 3 in the thickness direction in the substrate part 2 and a center part of the via 3; and metal parts 4, each of which fills spaces above and below the first conductive part 6 disposed at the center part of the via 3. The structure improves the yield in manufacturing processes of an electronic circuit module using the multilayer substrate 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
