| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel epoxy compound with high heat resistance, which is used as an electronic material such as a semiconductor sealant. <P>SOLUTION: The epoxy compound is represented by general formula. (In the formula, X represents hydrogen atom or 1-18C monovalent substituent, R<SP POS="POST">1</SP>each independently represents 1-4C alkyl or halogen atom, R<SP POS="POST">2</SP>each independently represents 1-4C alkylene, R<SP POS="POST">3</SP>each independently represents hydrogen atom or methyl, m each independently represents an integer of 0 or 1, and n each independently represents an integer of 0-5). <P>COPYRIGHT: (C)2013,JPO&INPIT |
