SEMICONDUCTOR ELEMENT, IMAGE PICKUP ELEMENT, IMAGE PICKUP MODULE, IMAGE PICKUP APPARATUS, AND MANUFACTURING APPARATUS AND METHOD

摘要

PROBLEM TO BE SOLVED: To improve connectivity between a metallic material and a pad by suppressing corrosion of the pad.

SOLUTION: The semiconductor element comprises: an electrode serving as an external terminal of an internal circuit; and a protective film which is a thin film formed on a surface of the electrode and made of an inorganic material that protects the electrode to prevent contact with external moisture. This disclosure is applicable to a semiconductor element, an image pickup element, an image pickup module, an image pickup apparatus, and a manufacturing apparatus and method.

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