| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component pickup device and method and an electronic component mounting device and method, capable of obtaining stable mounting accuracy with a simple structure, for electronic components including a flexible region such as a flexible board. <P>SOLUTION: An electronic component pickup device mounts a module board 6 formed by connecting a rigid board 15 with a flexible board 16 on a tray member 20 provided with a first support part 20a and a second support part 20b different in height from each other, places the module board 6 being pressed to the tray member 20 and held by a pressing member 23 on a tray placing part 24, vacuum-sucks the module board 6 through vacuum holes 24b to allow the tray member 20 to suck and hold the module board 6 and then removes the pressing member 23, and allows a mounting head 10 to vacuum-suck the module board 6 and releases the sucking and holding by the tray member 20 to take out the module board 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
