| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a conducting circuit that enables a conducting circuit to be formed by printing, enables the shape to be kept well before and after curing, after printing, and also enables the formed circuit to have a high stress reducing capability for thermal stress or the like. <P>SOLUTION: The method for forming a conducting circuit by use of an ink composition for drawing a conducting circuit according to a printing method comprises the steps of: forming a print pattern of a dot shape having a diameter of 0.8 mm and a height of 0.4 mm; and thereafter thermally curing the print pattern at a temperature of 80-200°C. The ink composition for drawing a conducting circuit is arranged so that the change in the height of the dot shape in the case of comparing the printed shape of the print pattern with that after curing is within 5%. Further, the ink composition includes substantially no solvent, but comprises a combination of a precursor for additional type silicone resin formation and a curing catalyst, conductive particles, and a thixotropic agent selected from carbon black, zinc oxide, tin oxide, tin-antimony-based oxide and SiC. The invention allows the drawing of a circuit by use of an ink composition with thixotropy according to a printing method such as screen printing, and which enables the materialization of a drawn circuit such that the shape is kept well even after the circuit is subjected to a post-drawing curing step and the shape of the circuit can be controlled in an advanced manner. <P>COPYRIGHT: (C)2013,JPO&INPIT |
