| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board capable of minimizing variation in bore diameter due to conveyance scratches during horizontal conveyance and reducing laser processing energy, and to provide a surface preparation agent for use therein. <P>SOLUTION: The manufacturing method of a printed wiring board includes: a coating formation step for forming a copper compound coating (4) on the surface of a copper layer (3), i.e., the surface layer of a laminate sheet for producing a printed wiring board on which insulating layers (1a, 2) and copper layers (1b, 3) are laminated; and a bore formation step for forming bores (BV) by emitting infrared laser light from the copper compound coating (4) side. The surface of the copper layer (3) on which the copper compound coating (4) is formed has a center line average roughness Ra of 0.20 μm or more, and the copper compound coating (4) contains 0.5-10.0 g/m<SP POS="POST">2</SP>of copper halide per unit area of the surface of the copper layer (3). <P>COPYRIGHT: (C)2013,JPO&INPIT |
