| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which improves heat radiation performance and concurrently ensures the design flexibility. <P>SOLUTION: A semiconductor device includes: a mounting substrate 1 which has an insulative support substrate 2, a first upper surface electrode 4a and a second upper surface electrode 4b which are provided on an upper surface of the support substrate 2, lower surface electrodes 5a, 5b which are provided on a lower surface of the support substrate 2, and a heat sink 3 buried in the support substrate 2; and a semiconductor element 10 which has a first electrode 15a and a second electrode 15b and is mounted on at least the first upper surface electrode 4a. The semiconductor device has conductive materials 6, each of which is provided in the mounting substrate 1 and connects the first upper surface electrode with the lower surface electrode, and the conductive materials 6 connect with the heat sink 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
