| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED module that allows achieving high luminance. <P>SOLUTION: An LED module 101 includes an LED chip 200 as a light source. The LED chip 200 has a submount substrate 210 composed of Si, and a semiconductor layer 220 stacked on the submount substrate 210. The LED module 101 includes a white resin 700 that covers at least a part of a side surface 210 connected to the surface on which the semiconductor layer 220 is stacked of the submount substrate 210 and does not transmit light from the semiconductor layer 220. A side surface 211 covered with the white resin 700 is located near the semiconductor layer 220 in a first direction that is a stacked direction of the semiconductor layer 220 and has a projection 211a projecting away from the semiconductor layer 220 in the first direction view. <P>COPYRIGHT: (C)2013,JPO&INPIT |
