| 摘要 |
<P>PROBLEM TO BE SOLVED: To be able to flow a greater effective current than before on a higher temperature side. <P>SOLUTION: An optical coupling device includes a power element chip 13. An element mounting pad 17 having the power element chip 13 mounted thereon includes a heat dissipation member 18 connected to the pad 17 by using a tie bar. The heat dissipation member 18 is bent at the tie bar and superposed on the element mounting pad 17, to thereby increase heat capacity of a heat dissipation part including the heat dissipation member 18 and the element mounting pad 17 and expand the heat dissipation area. When the optical coupling device is mounted on a mounting board, heat transference to the mounting board can be increased to increase a heat dissipation effect more than before. Accordingly, the device can flow a greater effective current than before on a higher temperature side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
