| 摘要 |
<P>PROBLEM TO BE SOLVED: To bend an external derivation terminal by 90° without damaging the surface. <P>SOLUTION: A depressing member 100d is moved down the side plates 100c1 and 100c2 relatively fixed on a semiconductor device 10; the contacting parts 100b1b3 and 100b1c3 of a support member 100b1 are depressed by the depressing surface 100d1a of a depressing member 100d; while the posture is being maintained, the support member 100b1 and a depressing member 100a1 are obliquely moved down parallel to the guide grooves 100c1a and 100c2a of the side plates 100c1 and 100c2; the side face 100a1b of the depressing member 100a1 is made contact with an external derivation terminal 10b1 extending up in the vertical direction; thereafter, when the external derivation terminal 10b1 begins to bend, the bridging surface 100a1c of the depressing member 100a1 is made contact with the external derivation terminal 10b1; and thereafter, when the undersurface 100a1a of the depressing member 100a1 contacts with the external derivation terminal 10b1, the bending angle of the external derivation terminal 10b1 becomes 90°. <P>COPYRIGHT: (C)2013,JPO&INPIT |
