| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem of a semiconductor light-emitting device covered with a white member that a coating material adheres to a light-emitting surface of a light-emitting element to cause reduction of an adhesion force thereto at the time of filling or hardening the white member; mixture of a fluorescent material that improves color rendering property is difficult; and reliability is not improved because the light-emitting element is insufficiently covered with the white member. <P>SOLUTION: A semiconductor light-emitting device includes a fluorescent plate adhered to a light-emitting surface of a semiconductor light-emitting element having bump electrodes on an undersurface, and a reflective white resin covering lateral faces of the semiconductor light-emitting element. The fluorescent plate has a recess shape on a surface adhered to the semiconductor light-emitting element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
