发明名称 HEAT SINK WITH HIGHLY HEAT-CONDUCTING RESIN, AND LED LIGHT SOURCE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin heat sink which can be used as an alternative of a metal heat sink, and which is excellent in processability, productivity, and lightness in weight. <P>SOLUTION: The heat sink 1 has a highly heat-conducting resin 2 used therein. The heat sink is formed by uniting a highly heat-conducting resin composition which includes a synthetic resin and a heat-conducting filler and which has a thermal conductivity of 0.5 [W/mK] or larger, and a base material 3 composed of a compact of metal or ceramic, followed by shaping. The heat sink 1 has an opposite-to-heat-source face 6 facing a heat source; at least one part of the opposite-to-heat-source face 6 is directly formed by the base material 3, otherwise the highly heat-conducting resin having a thickness of 3 mm or smaller is interposed between the at least one part and the base material 3. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089718(A) 申请公布日期 2013.05.13
申请号 JP20110227870 申请日期 2011.10.17
申请人 KANEKA CORP 发明人 KATAYAMA SATOSHI;KUJI NAOKO
分类号 H01L23/36;F21V29/00;H01L23/373;H01L33/64 主分类号 H01L23/36
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