| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate capable of sufficiently reducing a loop impedance between a part from an electronic component connection pad for power supply to an external connection pad for power supply and a part from an electronic component connection pad for grounding to an external connection pad for grounding to make an electronic component such as a semiconductor element and the like to be mounted operate suitably. <P>SOLUTION: Above all of a plurality of external connection pads 6(G) and 6(P) for grounding or for power supply that are aggregated and arranged on a lower surface of an insulation substrate 1, wiring conductors 2(G) and 2(P) for grounding or for power supply are arranged. The aggregated and arranged external connection pads 6(G) and 6(P) for grounding or for power supply, and the wiring conductors 2(G) and 2(P) for grounding or for power supply arranged above those, are electrically connected with each other through via conductors 4 respectively connected to the aggregated and arranged external connection pads 6(G) and 6(P) for grounding or for power supply. <P>COPYRIGHT: (C)2013,JPO&INPIT |
