发明名称 STRUCTURE OF THERMAL CONDUCTIVE FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PURPOSE: A structure of a thermal conductive flexible wiring board is provided to perform post processing conveniently, as having good thermal conductivity and conductivity effect. CONSTITUTION: A structure of a thermal conductive flexible wiring board(5) includes a release film(51), a thermal conductive adhesive film(52) and a conductive film(53). The thermal conductive adhesive film is provided on one surface of the release film, and has an epoxy resin, organic solvent and thermal conductive particles, and is formed through mixing, grinding, curing and semi-hardening. The conductive film is provided on one surface of the thermal conductive adhesive film, and has an etched pattern region.
申请公布号 KR20130049087(A) 申请公布日期 2013.05.13
申请号 KR20110114138 申请日期 2011.11.03
申请人 TEAMCHEM COMPANY 发明人 YEH SYH TAU
分类号 H05K1/02;H01L33/64;H05K7/20 主分类号 H05K1/02
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