发明名称 PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed circuit board. <P>SOLUTION: The printed circuit board comprises: a base substrate which has a first face and a second face, the second face having a circuit layer formed, and the circuit layer containing connection pads and a circuit pattern; a solder resist formed to have openings to expose the connection pads on the second face of the base substrate; a bridge member formed on the solder resist and formed at part of the solder resist; and a support member formed on the bridge member so as to cover the second face of the base substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089943(A) 申请公布日期 2013.05.13
申请号 JP20110288634 申请日期 2011.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JANG YOUNG SU;KIM KYUNG TAE;CHO SOON JIN
分类号 H05K3/28;H05K1/02 主分类号 H05K3/28
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