METHOD FOR FORMING THROUGH HOLE IN INSULATING SUBSTRATE AND METHOD FOR MANUFACTURING INSULATING SUBSTRATE FOR INTERPOSER

摘要

PROBLEM TO BE SOLVED: To provide a method in which dislocation hardly occurs in a formation position when forming a plurality of through holes in an insulating substrate.

SOLUTION: When forming the plurality of through holes in the insulating substrate using laser guiding type electric discharge technology, the through holes are formed from an objective position that is a centermost position and then positions for forming the through holes are expanded outward.

COPYRIGHT: (C)2013,JPO&INPIT