| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold with a heating device capable of uniformizing a temperature distribution of the surface of the mold and reducing a cost. <P>SOLUTION: The mold with the heating device contains: an upper mold 10 having an upper combination surface 11; a lower mold 20 which has a conductible conductive layer 21, a lower combination surface 211 mounted on the surface of the conductive layer 21 and facing to the upper combination surface 11, an insulation surface 212 mounted on the surface of the conductive layer 21 and located on the opposite side of the lower combination surface 211, and an insulation layer 22 insulatively combined with the insulation surface 212 and which is engageable with the upper mold 10; two conductive plates 30 conductively mounted on the conductive layer 21 of the lower mold 20; and two conductive cables 40 that are disposed at the conductive plates 30 to be conductive, and whose electric resistance coefficients are smaller than the electric resistance coefficient of the conductive layer 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
