| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reflow soldering device which can be made small in size. <P>SOLUTION: The reflow soldering device 30 includes: (a) a case in which a work 10 is conveyed; (b) a heater 36 which is arranged, in the case, below a work conveyance route for conveying the work 10 and applies a heat ray toward the work conveyance route; and (b) shielding members 40, 50 and 52 which shield the upper side from the work conveyance route and form, in the case, a closed space 58 communicated with the work conveyance route above the work conveyance route. <P>COPYRIGHT: (C)2013,JPO&INPIT |
