| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic component which can suppress outflow of grease when thermal grease is applied to a component contact surface in the case that a vertical direction conduction surface and a vertical surface of an electronic component housed in an electronic module match, and to provide an electronic module having the same. <P>SOLUTION: A heat radiation structure of an electronic component is constituted by: a module case 1 having a bottom face part and side face parts crossing the bottom face part; an electronic component 5 housed in the module case 1; and a plate which is fixed on the bottom face part 2 and the side face part 3 of the module case 1 and has an L-shaped bent part 7 contacting a corner part where the bottom face part 2 and the side face part 3 cross each other. The heat radiation structure includes: an attachment auxiliary plate 6 which is interposed between the electronic component 5 and the module case 1 and conducts heat generated by the electronic component 5 to the module case 1; a first thermal grease layer 8 between the attachment auxiliary plate 6 and the bottom face part 2; and a second thermal grease layer 9 isolated from the first thermal grease layer 8 by the bent part 7 between the attachment auxiliary plate 6 and the side face part 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
