| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device package manufacturing method and a semiconductor device package, which can control limitation on a shape and an industrial design of a semiconductor device in manufacturing of the semiconductor device, and which allow manufacturing of a high-quality semiconductor device with high productivity and at low cost. <P>SOLUTION: A semiconductor device package manufacturing method comprises the steps of: setting a lead frame between an upper mold having a cavity recess for molding a molding part and a lower mold having a flat surface so as to face up a chip mounting region; filling a molding material in the cavity recess while clamping a coupling part and a part of signal connection terminals adjacent to the coupling part with a press block; and molding a molding part such that die pad parts of a plurality of chip mounting parts and the part of signal connection terminals clamped by the press block are exposed on a top face, signal connection terminals on an opposite side to the chip mounting region are exposed on an undersurface, and thereby a plurality of external electrodes are exposed on both faces. <P>COPYRIGHT: (C)2013,JPO&INPIT |
