| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer sawing system and a method for cutting an ingot using a saw in the wafer sawing system. <P>SOLUTION: The system includes an ingot input module, an ingot output module, two or more wire sawing chambers each having two wire guide cylinders, at least one wire arranged over both wire guide cylinders, a support table configured to receive a single ingot, and an ingot positioning system configured to bias the single ingot arranged on the support table to at least one wire, and a robot which is configured to transport the single ingot among the ingot input module, at least one of the two or more wire sawing chambers, and the ingot output chamber. <P>COPYRIGHT: (C)2013,JPO&INPIT |
