发明名称 METHOD FOR CUTTING Cu-Ga ALLOY AND METHOD FOR MANUFACTURING SPUTTERING TARGET
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for cutting a Cu-Ga alloy in which even a Cu-Ga alloy ingot with a relatively large Ga composition ratio can be cut into a desired shape without lowering productivity and without causing cracking or chipping. <P>SOLUTION: The method for cutting the Cu-Ga alloy includes a heat treatment step and a slicing step. In the heat treatment step, the Cu-Ga alloy ingot 81 with a rectangular parallelepiped shape manufactured by melt casting is heat-treated under a temperature not less than 450&deg;C but less than 700&deg;C. Next, in the slicing step, the heat-treated Cu-Ga alloy ingot 81 is cut with a diamond band saw device 1 or a multi-wire saw device 10 in such a manner that a cut surface is perpendicular to the shortest side of the rectangular parallelepiped shape. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013086238(A) 申请公布日期 2013.05.13
申请号 JP20110231171 申请日期 2011.10.20
申请人 SUMITOMO CHEMICAL CO LTD 发明人 SATO HISAYA;YAMASHITA KAZUKI
分类号 B24B27/06;B23D53/00;C23C14/34 主分类号 B24B27/06
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