| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrain seam between a conductor layer and a filled conductor. <P>SOLUTION: A wiring board has: a core insulation layer; a plurality of first face side conductor layers formed on a first face side of the core insulation layer and a first face side interlayer insulation layer between the layers; a plurality of second face side conductor layers formed on a second face side of the core insulation layer and a second face side interlayer insulation layer between the layers; and a through hole conductor connected to the first face side conductor layers at one end and connected to the second face side conductor layers at the other end. A via conductor including a power supply layer and electrolytic plating formed on the power supply layer is formed on each of the interlayer insulation layers. Also, the through hole conductor includes a power supply layer made of electroless plating, and electrolytic plating formed on the power supply layer. Then, the power supply layers of the via conductors formed on the first face side interlayer insulation layer and the second face side interlayer insulation layer under a conductor layer connected to one end or the other end of the through hole conductor are made of electroless plating, and the supply power layers of the other via conductors are made of a material different from the electroless plating, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
