发明名称 EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition by which there can be provided a base material capable of maintaining flame retardancy even when a halogen based flame retardant is not incorporated in the epoxy resin composition and having excellent surface smoothness and appearance, to provide a prepreg obtained from the composition, to provide a metal-clad laminate in which a resin insulation layer is formed from the composition, and to provide a printed wiring board. <P>SOLUTION: There is provided the epoxy resin composition including: (A) a polymer compound having, as constituent, phosphaphenanthrenes and at least one kind selected from a constitutional unit of phenol novolak polymer and a constitutional unit of a phenol novolak polymer whose hydrogen atom of a phenolic hydroxyl group is substituted with phosphaphenanthrenes; (B) an epoxy resin having two or more epoxy groups in one molecule; (C) a curing agent curing the epoxy resin; and (D) a surface preparation agent; wherein 1 to 5 pts.wt. acrylic copolymer is mixed as the (D) surface preparation agent. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013087253(A) 申请公布日期 2013.05.13
申请号 JP20110231444 申请日期 2011.10.21
申请人 PANASONIC CORP 发明人 NAKAMURA YOSHIHIKO;SAGARA TAKASHI;ARISAWA TATSUYA;ARAI DAISUKE
分类号 C08G59/62;C08J5/24;H05K1/03 主分类号 C08G59/62
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