| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate structure in which reduction of design flexibility of a wiring pattern formed on a circuit board with a built-in capacitor can be limited, and characteristic failure is less likely to occur, and to provide a manufacturing method of a circuit board with a built-in capacitor having such a laminate structure. <P>SOLUTION: In the laminate structure, a first electrode layer 11 is formed on the front surface of a first part 31 of a dielectric layer 3 that configures a capacitor. A second electrode layer 12 is formed on the rear surface of the first part 31. A first conductive layer 21 is formed at a second part 32 of the dielectric layer 3 different from the first part 31, on the surface of the second part 32 while spaced apart from the first electrode layer 11. A second conductive layer 22 is formed on the rear surface of the second part 32 while spaced apart from the second electrode layer 12. A first conductive part 41 penetrates the second part 32 from the front surface to the rear surface, and connects the first conductive layer 21 and the second conductive layer 22 electrically. <P>COPYRIGHT: (C)2013,JPO&INPIT |
