| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure excellent high frequency characteristics and high insulation reliability. <P>SOLUTION: A flexible printed circuit board 100 comprises: a base material 10; wiring 11; and a coverlay 12. When the coverlay 12 is thermocompression bonded to the base material 10, a subsidiary material 15 having a melting point lower than that of the coverlay 12 is mounted on the coverlay 12, and thermocompression bonding is carried out while raising the temperature from the melting point of the subsidiary material 15 toward the melting point of the coverlay 12. Consequently, the flexible printed circuit board is formed so that the thickness t1+d1 from the surface of the base material 10 in a region where the wiring 11 exists to the surface of the coverlay 12 is thicker than the thickness t2 from the surface of the base material 10 in a recess 13 that is a region where the wiring 11 does not exist to the surface of the coverlay 12. Since the edge of the wiring 11 is not exposed from the coverlay 12, excellent high frequency characteristics and high reliability can be ensured. <P>COPYRIGHT: (C)2013,JPO&INPIT |
