METHOD OF CONTROLLING A THERMAL BUDGET OF AN INTEGRATED CIRCUIT DEVICE, AN INTEGRATED CIRCUIT, A THERMAL CONTROL MODULE AND AN ELECTRONIC DEVICE THEREFOR

摘要

A method of controlling a thermal budget of an integrated circuit device is described. The method comprises obtaining a first junction temperature measurement value T1 for the integrated circuit device at a first time instant t1, and a further junction temperature measurement value T2 for the integrated circuit device at a further time instant t2. The method further comprises calculating a prospective junction temperature value TP for the integrated circuit device at a future time instant tp based at least partly on the first and further junction temperature measurement values T1 and T2; and configuring an operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value TP.