SEMICONDUCTOR PACKAGE AND THE FABRIATION METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a fabrication method thereof are provided to improve the accuracy and speed of a molding process and an assembling process of a substrate and a body. CONSTITUTION: A body(120) is assembled in the upper part of a support substrate(110). The support substrate has a combination groove(111) for easily assembling the support substrate with the body. A molding unit(150) covers an active circuit element(140). An upper substrate(130) is assembled in the upper part of the body and the molding unit. The upper substrate includes the molding unit and a protrusion(131) on a contact surface.