VIA STRUCTURE FOR TRANSMITTING DIFFERENTIAL SIGNALS
摘要
A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.
申请公布号
WO2013036862(A3)
申请公布日期
2013.05.10
申请号
WO2012US54301
申请日期
2012.09.07
申请人
SAMTEC, INC.;BIDDLE, GARY ELLSWORTH;NADOLNY, JAMES