| 摘要 |
<p>A bonding wedge particularly suitable for making wire off-die interconnects includes an aperture (aperture) opening onto a notch (notch) or pocket adjacent to the rear of a foot (foot). The foot includes a heel portion (heel) and a toe portion (toe). When the bonding wedge is in use, a wire is fed from feedstock through the aperture and the notch or pocket, and passes beneath the foot and extends beyond the toe. The toe is configured to mitigate upward displacement of the free end (free end) of the wire during the bonding process.</p> |
